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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K7K1618U2C-FC45 |
| Description | QDR SRAM; No. of Terminals: 165; Package Shape: RECTANGULAR; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Peak Reflow Temperature (C): 240; |
| Datasheet | K7K1618U2C-FC45 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| No. of Terminals: | 165 |
| Qualification: | Not Qualified |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| JESD-30 Code: | R-PBGA-B165 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Peak Reflow Temperature (C): | 240 |
| Surface Mount: | YES |
| Memory IC Type: | QDR SRAM |
| Moisture Sensitivity Level (MSL): | 3 |









