K7K1618U2C-FI450 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K7K1618U2C-FI450
Description	STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: BGA; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
Datasheet	K7K1618U2C-FI450 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.4 Amp
Organization:	1MX18
Output Characteristics:	3-STATE
Sub-Category:	SRAMs
Surface Mount:	YES
Maximum Supply Current:	850 mA
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	165
Maximum Clock Frequency (fCLK):	450 MHz
No. of Words:	1048576 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B165
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	BGA
Moisture Sensitivity Level (MSL):	3
Input/Output Type:	COMMON
Memory Density:	18874368 bit
Minimum Standby Voltage:	1.7 V
Memory IC Type:	STANDARD SRAM
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Memory Width:	18
Qualification:	Not Qualified
Package Equivalence Code:	BGA165,11X15,40
Maximum Access Time:	.45 ns
No. of Words Code:	1M
Peak Reflow Temperature (C):	240
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	1.5,1.8

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