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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K7N321831C-FI16T |
| Description | ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: BGA; Package Shape: RECTANGULAR; Technology: CMOS; |
| Datasheet | K7N321831C-FI16T Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .1 Amp |
| Organization: | 2MX18 |
| Output Characteristics: | 3-STATE |
| Sub-Category: | SRAMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 360 mA |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 165 |
| Maximum Clock Frequency (fCLK): | 166 MHz |
| No. of Words: | 2097152 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B165 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Input/Output Type: | COMMON |
| Memory Density: | 37748736 bit |
| Minimum Standby Voltage: | 2.38 V |
| Memory IC Type: | ZBT SRAM |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 18 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA165,11X15,40 |
| Maximum Access Time: | 3.5 ns |
| No. of Words Code: | 2M |
| Peak Reflow Temperature (C): | 240 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 2.5,3.3 |
