K7Q161862B-FC16T by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K7Q161862B-FC16T
Description	QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Technology: CMOS;
Datasheet	K7Q161862B-FC16T Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	1MX18
Maximum Seated Height:	1.4 mm
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
No. of Terminals:	165
No. of Words:	1048576 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B165
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	LBGA
Width:	13 mm
Memory Density:	18874368 bit
Memory IC Type:	QDR SRAM
Minimum Operating Temperature:	0 Cel
Memory Width:	18
No. of Functions:	1
Qualification:	Not Qualified
Length:	15 mm
Maximum Access Time:	2.5 ns
No. of Words Code:	1M
Nominal Supply Voltage / Vsup (V):	2.5
Additional Features:	PIPELINED ARCHITECTURE
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	2.6 V

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