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Manufacturer | Samsung |
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Manufacturer's Part Number | K7Z167288B-HC35 |
Description | LATE-WRITE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 209; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words: 262144 words; |
Datasheet | K7Z167288B-HC35 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 256KX72 |
Maximum Seated Height: | 2.2 mm |
Minimum Supply Voltage (Vsup): | 1.7 V |
Surface Mount: | YES |
No. of Terminals: | 209 |
No. of Words: | 262144 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B209 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 70 Cel |
Package Code: | BGA |
Width: | 14 mm |
Memory Density: | 18874368 bit |
Memory IC Type: | LATE-WRITE SRAM |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 72 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Length: | 22 mm |
Maximum Access Time: | 2.6 ns |
No. of Words Code: | 256K |
Nominal Supply Voltage / Vsup (V): | 1.8 |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | 1 mm |
Temperature Grade: | COMMERCIAL |
Maximum Supply Voltage (Vsup): | 1.95 V |