Samsung - K7Z167288B-HC35

K7Z167288B-HC35 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K7Z167288B-HC35
Description LATE-WRITE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 209; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words: 262144 words;
Datasheet K7Z167288B-HC35 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 256KX72
Maximum Seated Height: 2.2 mm
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 209
No. of Words: 262144 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B209
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 14 mm
Memory Density: 18874368 bit
Memory IC Type: LATE-WRITE SRAM
Minimum Operating Temperature: 0 Cel
Memory Width: 72
No. of Functions: 1
Qualification: Not Qualified
Length: 22 mm
Maximum Access Time: 2.6 ns
No. of Words Code: 256K
Nominal Supply Voltage / Vsup (V): 1.8
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 1.95 V
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