K8A3215EBE-DC7B by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K8A3215EBE-DC7B
Description	FLASH; Temperature Grade: COMMERCIAL; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words: 2097152 words; Parallel or Serial: PARALLEL;
Datasheet	K8A3215EBE-DC7B Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	2MX16
Programming Voltage (V):	1.8
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Words:	2097152 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Moisture Sensitivity Level (MSL):	3
Memory Density:	33554432 bit
Memory IC Type:	FLASH
JESD-609 Code:	e1
Minimum Operating Temperature:	0 Cel
Memory Width:	16
No. of Functions:	1
Qualification:	Not Qualified
Maximum Access Time:	90 ns
No. of Words Code:	2M
Nominal Supply Voltage / Vsup (V):	1.8
Peak Reflow Temperature (C):	260
Parallel or Serial:	PARALLEL
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	1.95 V

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