K8A5615EBA-DE7B0 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K8A5615EBA-DE7B0
Description	FLASH; Temperature Grade: OTHER; Package Code: BGA; Package Shape: UNSPECIFIED; Operating Mode: ASYNCHRONOUS; Surface Mount: YES;
Datasheet	K8A5615EBA-DE7B0 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	16MX16
Programming Voltage (V):	1.8
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Words:	16777216 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	X-PBGA-B
Package Shape:	UNSPECIFIED
Terminal Form:	BALL
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	BGA
Moisture Sensitivity Level (MSL):	2
Boot Block:	BOTTOM
Memory Density:	268435456 bit
Memory IC Type:	FLASH
JESD-609 Code:	e1
Minimum Operating Temperature:	-25 Cel
Memory Width:	16
No. of Functions:	1
Type:	NOR TYPE
Qualification:	Not Qualified
Maximum Access Time:	90 ns
No. of Words Code:	16M
Nominal Supply Voltage / Vsup (V):	1.8
Additional Features:	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Parallel or Serial:	PARALLEL
Temperature Grade:	OTHER
Maximum Supply Voltage (Vsup):	1.95 V

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