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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K8A6415EBC-SC7D0 |
| Description | FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | K8A6415EBC-SC7D0 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Programming Voltage (V): | 1.8 |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Technology: | CMOS |
| No. of Sectors/Size: | 8,127 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Package Code: | TFBGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Toggle Bit: | YES |
| Memory Width: | 16 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA88,8X12,32 |
| Additional Features: | BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
| Maximum Standby Current: | .00005 Amp |
| Organization: | 4MX16 |
| Maximum Seated Height: | 1.1 mm |
| Maximum Supply Current: | 70 mA |
| Command User Interface: | YES |
| No. of Terminals: | 88 |
| No. of Words: | 4194304 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| JESD-30 Code: | R-PBGA-B88 |
| Maximum Operating Temperature: | 70 Cel |
| Width: | 8 mm |
| Boot Block: | BOTTOM |
| Memory Density: | 67108864 bit |
| Sector Size (Words): | 4K,32K |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | 0 Cel |
| Page Size (words): | 8 |
| No. of Functions: | 1 |
| Type: | NOR TYPE |
| Common Flash Interface: | YES |
| Length: | 11 mm |
| Maximum Access Time: | 70 ns |
| No. of Words Code: | 4M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Parallel or Serial: | PARALLEL |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 1.95 V |
| Data Polling: | YES |
| Power Supplies (V): | 1.8 |
