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Manufacturer | Samsung |
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Manufacturer's Part Number | K8C1215EBM-DC1C0 |
Description | FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 167; Package Code: LFBGA; Package Shape: RECTANGULAR; Common Flash Interface: YES; |
Datasheet | K8C1215EBM-DC1C0 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Programming Voltage (V): | 1.8 |
Minimum Supply Voltage (Vsup): | 1.7 V |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Technology: | CMOS |
No. of Sectors/Size: | 4,511 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | ASYNCHRONOUS |
Package Code: | LFBGA |
Moisture Sensitivity Level (MSL): | 3 |
Toggle Bit: | YES |
Memory Width: | 16 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA167,12X15,32 |
Additional Features: | SYNCHRONOUS BURST MODE OPERATION IS ALSO POSSIBLE |
Ready or Busy: | YES |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .8 mm |
Maximum Standby Current: | .00002 Amp |
Organization: | 32MX16 |
Maximum Seated Height: | 1.4 mm |
Maximum Supply Current: | 70 mA |
Command User Interface: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 167 |
No. of Words: | 33554432 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
JESD-30 Code: | R-PBGA-B167 |
Maximum Operating Temperature: | 70 Cel |
Width: | 10.5 mm |
Boot Block: | BOTTOM |
Memory Density: | 536870912 bit |
Sector Size (Words): | 16K,64K |
Memory IC Type: | FLASH |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
No. of Functions: | 1 |
Type: | NOR TYPE |
Common Flash Interface: | YES |
Length: | 14 mm |
Maximum Access Time: | 110 ns |
No. of Words Code: | 32M |
Nominal Supply Voltage / Vsup (V): | 1.8 |
Parallel or Serial: | PARALLEL |
Temperature Grade: | COMMERCIAL |
Maximum Supply Voltage (Vsup): | 1.95 V |
Data Polling: | YES |
Power Supplies (V): | 1.8 |