K8C1215ETM-DE1F0 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K8C1215ETM-DE1F0
Description	FLASH; Temperature Grade: OTHER; No. of Terminals: 167; Package Code: LFBGA; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 2;
Datasheet	K8C1215ETM-DE1F0 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	32MX16
Maximum Seated Height:	1.4 mm
Programming Voltage (V):	1.8
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	167
No. of Words:	33554432 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B167
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	LFBGA
Width:	10.5 mm
Moisture Sensitivity Level (MSL):	2
Boot Block:	TOP
Memory Density:	536870912 bit
Memory IC Type:	FLASH
JESD-609 Code:	e1
Minimum Operating Temperature:	-25 Cel
Memory Width:	16
No. of Functions:	1
Type:	NOR TYPE
Qualification:	Not Qualified
Length:	14 mm
Maximum Access Time:	110 ns
No. of Words Code:	32M
Nominal Supply Voltage / Vsup (V):	1.8
Additional Features:	SYNCHRONOUS BURST MODE OPERATION IS ALSO POSSIBLE
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	OTHER
Maximum Supply Voltage (Vsup):	1.95 V

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