Samsung - K8C5715EBM-FC1C

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K8C5715EBM-FC1C by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K8C5715EBM-FC1C
Description FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 167; Package Code: FBGA; Package Shape: RECTANGULAR; No. of Sectors/Size: 4,255;
Datasheet K8C5715EBM-FC1C Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00002 Amp
Organization: 16MX16
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 55 mA
Command User Interface: YES
No. of Terminals: 167
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B167
No. of Sectors/Size: 4,255
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: FBGA
Boot Block: BOTTOM
Memory Density: 268435456 bit
Sector Size (Words): 16K,64K
Toggle Bit: YES
Memory IC Type: FLASH
Minimum Operating Temperature: 0 Cel
Memory Width: 16
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA167,12X15,32
Common Flash Interface: YES
Maximum Access Time: 100 ns
No. of Words Code: 16M
Nominal Supply Voltage / Vsup (V): 1.8
Ready or Busy: YES
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL
Data Polling: YES
Power Supplies (V): 1.8
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