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Manufacturer | Samsung |
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Manufacturer's Part Number | K8D1716UTC-DC09T |
Description | FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .000018 Amp; |
Datasheet | K8D1716UTC-DC09T Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .000018 Amp |
Organization: | 1MX16 |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Maximum Supply Current: | 50 mA |
Command User Interface: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 48 |
No. of Words: | 1048576 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B48 |
No. of Sectors/Size: | 8,31 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Package Code: | FBGA |
Moisture Sensitivity Level (MSL): | 3 |
Boot Block: | TOP |
Memory Density: | 16777216 bit |
Sector Size (Words): | 8K,64K |
Toggle Bit: | YES |
Memory IC Type: | FLASH |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 16 |
Type: | NOR TYPE |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA48,6X8,32 |
Alternate Memory Width: | 8 |
Common Flash Interface: | YES |
Maximum Access Time: | 90 ns |
No. of Words Code: | 1M |
Ready or Busy: | YES |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .8 mm |
Temperature Grade: | COMMERCIAL |
Data Polling: | YES |
Power Supplies (V): | 3/3.3 |