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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K8D6316UBM-PI07T |
| Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Data Polling: YES; |
| Datasheet | K8D6316UBM-PI07T Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00003 Amp |
| Organization: | 4MX16 |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 50 mA |
| Command User Interface: | YES |
| No. of Terminals: | 56 |
| No. of Words: | 4194304 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G56 |
| No. of Sectors/Size: | 8,127 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TSSOP |
| Boot Block: | BOTTOM |
| Memory Density: | 67108864 bit |
| Sector Size (Words): | 8K,64K |
| Toggle Bit: | YES |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 16 |
| Type: | NOR TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP56,.8,20 |
| Alternate Memory Width: | 8 |
| Common Flash Interface: | YES |
| Maximum Access Time: | 70 ns |
| No. of Words Code: | 4M |
| Ready or Busy: | YES |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Data Polling: | YES |
| Power Supplies (V): | 3/3.3 |
