Samsung - K8D6316UTM-TI08T

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K8D6316UTM-TI08T by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K8D6316UTM-TI08T
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 50 mA;
Datasheet K8D6316UTM-TI08T Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00003 Amp
Organization: 4MX16
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 50 mA
Command User Interface: YES
No. of Terminals: 48
No. of Words: 4194304 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B48
No. of Sectors/Size: 8,127
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Boot Block: TOP
Memory Density: 67108864 bit
Sector Size (Words): 8K,64K
Toggle Bit: YES
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA48,6X8,32
Alternate Memory Width: 8
Common Flash Interface: YES
Maximum Access Time: 80 ns
No. of Words Code: 4M
Ready or Busy: YES
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Data Polling: YES
Power Supplies (V): 3/3.3
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