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Manufacturer | Samsung |
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Manufacturer's Part Number | K8P2815UQB-DI4BT |
Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 80; Package Code: FBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1; |
Datasheet | K8P2815UQB-DI4BT Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .00003 Amp |
Organization: | 8MX16 |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Maximum Supply Current: | 55 mA |
Command User Interface: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 80 |
No. of Words: | 8388608 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B80 |
No. of Sectors/Size: | 16,254 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Moisture Sensitivity Level (MSL): | 3 |
Boot Block: | BOTTOM/TOP |
Memory Density: | 134217728 bit |
Sector Size (Words): | 4K,32K |
Toggle Bit: | YES |
Memory IC Type: | FLASH |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 16 |
Page Size (words): | 8 |
Type: | NOR TYPE |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA80,8X12,32 |
Common Flash Interface: | YES |
Maximum Access Time: | 60 ns |
No. of Words Code: | 8M |
Ready or Busy: | YES |
Peak Reflow Temperature (C): | 260 |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Data Polling: | YES |
Power Supplies (V): | 3/3.3 |