K8P2915UQB-DE4AT by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K8P2915UQB-DE4AT
Description	FLASH; Temperature Grade: OTHER; No. of Terminals: 80; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00003 Amp;
Datasheet	K8P2915UQB-DE4AT Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00003 Amp
Organization:	8MX16
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	55 mA
Command User Interface:	YES
No. of Terminals:	80
No. of Words:	8388608 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B80
No. of Sectors/Size:	16,254
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	FBGA
Boot Block:	BOTTOM/TOP
Memory Density:	134217728 bit
Sector Size (Words):	4K,32K
Toggle Bit:	YES
Memory IC Type:	FLASH
Minimum Operating Temperature:	-25 Cel
Memory Width:	16
Page Size (words):	8
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA80,8X12,32
Common Flash Interface:	YES
Maximum Access Time:	55 ns
No. of Words Code:	8M
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	OTHER
Data Polling:	YES
Power Supplies (V):	3/3.3

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