K8P3315UQB-DC4D by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K8P3315UQB-DC4D
Description	FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Density: 33554432 bit;
Datasheet	K8P3315UQB-DC4D Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	2MX16
Maximum Seated Height:	1 mm
Programming Voltage (V):	3
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
No. of Terminals:	48
No. of Words:	2097152 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B48
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	VFBGA
Width:	6 mm
Boot Block:	BOTTOM/TOP
Memory Density:	33554432 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	0 Cel
Memory Width:	16
No. of Functions:	1
Qualification:	Not Qualified
Length:	8 mm
Maximum Access Time:	70 ns
No. of Words Code:	2M
Nominal Supply Voltage / Vsup (V):	3
Additional Features:	TOP AND BOTTOM BOOT BLOCK
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	3.6 V

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