K8P5615UQA-DI4DT by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K8P5615UQA-DI4DT
Description	EEPROM CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 84; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 50 mA;
Datasheet	K8P5615UQA-DI4DT Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00006 Amp
Organization:	16MX16
Programming Voltage (V):	2.7
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	50 mA
Command User Interface:	YES
No. of Terminals:	84
No. of Words:	16777216 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B84
No. of Sectors/Size:	8,126
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	FBGA
Moisture Sensitivity Level (MSL):	3
Boot Block:	BOTTOM/TOP
Memory Density:	268435456 bit
Sector Size (Words):	32K,128K
Toggle Bit:	YES
Memory IC Type:	EEPROM CARD
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA84,10X12,32
Common Flash Interface:	YES
Maximum Access Time:	70 ns
No. of Words Code:	16M
Ready or Busy:	YES
Peak Reflow Temperature (C):	260
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Data Polling:	YES
Power Supplies (V):	3/3.3

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