K8P6415UQB-EE4A0 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K8P6415UQB-EE4A0
Description	FLASH; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
Datasheet	K8P6415UQB-EE4A0 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	4MX16
Maximum Seated Height:	1.2 mm
Programming Voltage (V):	2.7
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
No. of Terminals:	64
No. of Words:	4194304 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B64
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TBGA
Width:	11 mm
Boot Block:	BOTTOM/TOP
Memory Density:	67108864 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-25 Cel
Memory Width:	16
No. of Functions:	1
Type:	NOR TYPE
Qualification:	Not Qualified
Length:	13 mm
Maximum Access Time:	55 ns
No. of Words Code:	4M
Nominal Supply Voltage / Vsup (V):	3
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	COMMERCIAL EXTENDED
Maximum Supply Voltage (Vsup):	3.6 V

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