Samsung - K8P6415UQB-EE4BT

K8P6415UQB-EE4BT by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K8P6415UQB-EE4BT
Description FLASH; Temperature Grade: OTHER; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; Type: NOR TYPE;
Datasheet K8P6415UQB-EE4BT Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00003 Amp
Organization: 4MX16
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 55 mA
Command User Interface: YES
No. of Terminals: 64
No. of Words: 4194304 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B64
No. of Sectors/Size: 16,126
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Moisture Sensitivity Level (MSL): 3
Boot Block: BOTTOM/TOP
Memory Density: 67108864 bit
Sector Size (Words): 4K,32K
Toggle Bit: YES
Memory IC Type: FLASH
Minimum Operating Temperature: -25 Cel
Memory Width: 16
Page Size (words): 8
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA64,8X8,40
Common Flash Interface: YES
Maximum Access Time: 60 ns
No. of Words Code: 4M
Ready or Busy: YES
Peak Reflow Temperature (C): 260
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: OTHER
Data Polling: YES
Power Supplies (V): 3/3.3
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