Samsung - K8P6415UQB-PI4B

K8P6415UQB-PI4B by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K8P6415UQB-PI4B
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Command User Interface: YES;
Datasheet K8P6415UQB-PI4B Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00003 Amp
Organization: 4MX16
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 55 mA
Command User Interface: YES
Terminal Finish: TIN BISMUTH
No. of Terminals: 48
No. of Words: 4194304 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G48
No. of Sectors/Size: 16,126
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Moisture Sensitivity Level (MSL): 3
Boot Block: BOTTOM/TOP
Memory Density: 67108864 bit
Sector Size (Words): 4K,32K
Toggle Bit: YES
Memory IC Type: FLASH
JESD-609 Code: e6
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Page Size (words): 8
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: TSSOP48,.8,20
Common Flash Interface: YES
Maximum Access Time: 60 ns
No. of Words Code: 4M
Ready or Busy: YES
Peak Reflow Temperature (C): 260
Parallel or Serial: PARALLEL
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Data Polling: YES
Power Supplies (V): 3/3.3
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