K8S1215EBC-DE1CT by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K8S1215EBC-DE1CT
Description	EEPROM CARD; Temperature Grade: OTHER; No. of Terminals: 64; Package Code: FBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -25 Cel;
Datasheet	K8S1215EBC-DE1CT Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00003 Amp
Organization:	32MX16
Programming Voltage (V):	2.7
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	70 mA
Command User Interface:	YES
Terminal Finish:	MATTE TIN
No. of Terminals:	64
No. of Words:	33554432 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B64
No. of Sectors/Size:	4,511
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	FBGA
Moisture Sensitivity Level (MSL):	1
Boot Block:	BOTTOM
Memory Density:	536870912 bit
Sector Size (Words):	16K,64K
Toggle Bit:	YES
Memory IC Type:	EEPROM CARD
JESD-609 Code:	e3
Minimum Operating Temperature:	-25 Cel
Memory Width:	16
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA64,10X14,20
Common Flash Interface:	YES
Maximum Access Time:	95 ns
No. of Words Code:	32M
Nominal Supply Voltage / Vsup (V):	1.8
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Terminal Pitch:	.5 mm
Temperature Grade:	OTHER
Data Polling:	YES
Power Supplies (V):	1.8

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