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Manufacturer | Samsung |
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Manufacturer's Part Number | K8S1315EBC-DE1ET |
Description | EEPROM CARD; Temperature Grade: OTHER; No. of Terminals: 64; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00003 Amp; |
Datasheet | K8S1315EBC-DE1ET Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .00003 Amp |
Organization: | 32MX16 |
Programming Voltage (V): | 2.7 |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Maximum Supply Current: | 70 mA |
Command User Interface: | YES |
Terminal Finish: | MATTE TIN |
No. of Terminals: | 64 |
No. of Words: | 33554432 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B64 |
No. of Sectors/Size: | 4,511 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Moisture Sensitivity Level (MSL): | 1 |
Boot Block: | BOTTOM |
Memory Density: | 536870912 bit |
Sector Size (Words): | 16K,64K |
Toggle Bit: | YES |
Memory IC Type: | EEPROM CARD |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -25 Cel |
Memory Width: | 16 |
Type: | NOR TYPE |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA64,10X14,20 |
Common Flash Interface: | YES |
Maximum Access Time: | 95 ns |
No. of Words Code: | 32M |
Nominal Supply Voltage / Vsup (V): | 1.8 |
Ready or Busy: | YES |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .5 mm |
Temperature Grade: | OTHER |
Data Polling: | YES |
Power Supplies (V): | 1.8 |