Samsung - K9E2G08B0M-FIB00

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K9E2G08B0M-FIB00 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K9E2G08B0M-FIB00
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VSSOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 2;
Datasheet K9E2G08B0M-FIB00 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 256MX8
Maximum Seated Height: .7 mm
Programming Voltage (V): 2.7
Minimum Supply Voltage (Vsup): 2.5 V
Surface Mount: YES
No. of Terminals: 48
No. of Words: 268435456 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G48
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: VSSOP
Width: 12 mm
Moisture Sensitivity Level (MSL): 2
Memory Density: 2147483648 bit
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Length: 15.4 mm
Maximum Access Time: 30 ns
No. of Words Code: 256M
Nominal Supply Voltage / Vsup (V): 2.7
Additional Features: CONTAINS ADDITIONAL 64M BIT SPARE MEMORY
Parallel or Serial: PARALLEL
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 2.9 V
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