Samsung - K9F1G08R0A-XCB00

K9F1G08R0A-XCB00 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K9F1G08R0A-XCB00
Description FLASH; Temperature Grade: COMMERCIAL; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Position: UPPER; Package Body Material: UNSPECIFIED;
Datasheet K9F1G08R0A-XCB00 Datasheet
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Organization: 128MX8
Programming Voltage (V): 1.8
Minimum Supply Voltage (Vsup): 1.65 V
Surface Mount: YES
No. of Words: 134217728 words
Terminal Position: UPPER
Package Style (Meter): UNCASED CHIP
Technology: CMOS
JESD-30 Code: R-XUUC-N
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: DIE
Memory Density: 1073741824 bit
Memory IC Type: FLASH
Minimum Operating Temperature: 0 Cel
Memory Width: 8
No. of Functions: 1
Type: SLC NAND TYPE
Qualification: Not Qualified
Maximum Access Time: 30 ns
No. of Words Code: 128M
Nominal Supply Voltage / Vsup (V): 1.8
Parallel or Serial: PARALLEL
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 1.95 V
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