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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K9F2G08U0A-PIB0 |
| Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Page Size (words): 2K; |
| Datasheet | K9F2G08U0A-PIB0 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00005 Amp |
| Organization: | 256MX8 |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 20 mA |
| Command User Interface: | YES |
| Terminal Finish: | TIN BISMUTH |
| No. of Terminals: | 48 |
| No. of Words: | 268435456 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G48 |
| No. of Sectors/Size: | 2K |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TSSOP |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 2147483648 bit |
| Sector Size (Words): | 128K |
| Toggle Bit: | NO |
| Memory IC Type: | FLASH |
| JESD-609 Code: | e6 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| Page Size (words): | 2K |
| Type: | SLC NAND TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP48,.8,20 |
| Maximum Access Time: | 20 ns |
| No. of Words Code: | 256M |
| Ready or Busy: | YES |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Data Polling: | NO |
| Power Supplies (V): | 3/3.3 |
