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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K9KAG08U1M-ICB00 |
| Description | FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 52; Package Code: VBGA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS; |
| Datasheet | K9KAG08U1M-ICB00 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .001 Amp |
| Organization: | 2GX8 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | .65 mm |
| Programming Voltage (V): | 2.7 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 30 mA |
| Command User Interface: | YES |
| No. of Terminals: | 52 |
| No. of Words: | 2147483648 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B52 |
| No. of Sectors/Size: | 4K |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | VBGA |
| Width: | 12 mm |
| Memory Density: | 17179869184 bit |
| Sector Size (Words): | 256K |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 8 |
| Page Size (words): | 4K |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LGA52(UNSPEC) |
| Length: | 17 mm |
| Maximum Access Time: | 20 ns |
| No. of Words Code: | 2G |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Ready or Busy: | YES |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 3.3 |
