K9WAG08U1M-IIB00 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K9WAG08U1M-IIB00
Description	FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1 mm;
Datasheet	K9WAG08U1M-IIB00 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	2GX8
Maximum Seated Height:	1 mm
Programming Voltage (V):	2.7
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
No. of Terminals:	52
No. of Words:	2147483648 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE
Technology:	CMOS
JESD-30 Code:	R-PBGA-BU52
Package Shape:	RECTANGULAR
Terminal Form:	BUTT
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	VBGA
Width:	12 mm
Moisture Sensitivity Level (MSL):	3
Memory Density:	17179869184 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Qualification:	Not Qualified
Length:	17 mm
Maximum Access Time:	20 ns
No. of Words Code:	2G
Nominal Supply Voltage / Vsup (V):	3.3
Additional Features:	CONTAINS ADDITIONAL 256M BIT SPARE NAND MEMORY
Peak Reflow Temperature (C):	260
Parallel or Serial:	PARALLEL
Terminal Pitch:	2 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

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