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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | KAA00B209M-TGSV |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 127; Package Code: FBGA; Package Shape: RECTANGULAR; Surface Mount: YES; |
| Datasheet | KAA00B209M-TGSV Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00001 Amp |
| Mixed Memory Type: | FLASH+PSRAM+SRAM |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | 35 mA |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -25 Cel |
| No. of Terminals: | 127 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA127,12X13,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | HYBRID |
| Maximum Access Time: | 100 ns |
| JESD-30 Code: | R-PBGA-B127 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 1.8,3 |
