Samsung - KAD090300B-TLLL0

KAD090300B-TLLL0 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number KAD090300B-TLLL0
Description MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 69; Package Code: LFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
Datasheet KAD090300B-TLLL0 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 4MX16
Maximum Seated Height: 1.4 mm
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
No. of Terminals: 69
No. of Words: 4194304 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B69
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 8 mm
Memory Density: 67108864 bit
Memory IC Type: MEMORY CIRCUIT
Minimum Operating Temperature: -40 Cel
Memory Width: 16
No. of Functions: 1
Qualification: Not Qualified
Length: 11.6 mm
No. of Words Code: 4M
Nominal Supply Voltage / Vsup (V): 2.9
Additional Features: UTRAM IS ORGANIZED AS 2M X 16; NOR FLASH CAN ALSO BE ORGANIZED AS 8M X 8
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.1 V
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