Samsung - KAE00C400M-TGNN0

KAE00C400M-TGNN0 by Samsung

Image shown is a representation only.

Manufacturer Samsung
Manufacturer's Part Number KAE00C400M-TGNN0
Description MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 111; Package Code: LFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -25 Cel;
Datasheet KAE00C400M-TGNN0 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 16MX8
Maximum Seated Height: 1.4 mm
Minimum Supply Voltage (Vsup): 2.3 V
Surface Mount: YES
No. of Terminals: 111
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B111
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 10 mm
Memory Density: 134217728 bit
Memory IC Type: MEMORY CIRCUIT
Minimum Operating Temperature: -25 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Length: 11 mm
No. of Words Code: 16M
Nominal Supply Voltage / Vsup (V): 2.5
Additional Features: UTRAM IS ORGANIZED AS 4M X 16; FLASH OPERATES AT 2.7V TO 3.6V SUPPLY
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 2.7 V
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products