KFG1G16Q2C-AEB6T by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	KFG1G16Q2C-AEB6T
Description	EEPROM CARD; Temperature Grade: OTHER; No. of Terminals: 63; Package Code: FBGA; Package Shape: RECTANGULAR; No. of Words Code: 64M;
Datasheet	KFG1G16Q2C-AEB6T Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00005 Amp
Organization:	64MX16
Programming Voltage (V):	2.7
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	40 mA
Command User Interface:	YES
No. of Terminals:	63
No. of Words:	67108864 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B63
No. of Sectors/Size:	1K
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	FBGA
Moisture Sensitivity Level (MSL):	3
Memory Density:	1073741824 bit
Sector Size (Words):	64K
Toggle Bit:	NO
Memory IC Type:	EEPROM CARD
Minimum Operating Temperature:	-30 Cel
Memory Width:	16
Page Size (words):	1K
Type:	NAND TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA63,10X12,32
Maximum Access Time:	11 ns
No. of Words Code:	64M
Nominal Supply Voltage / Vsup (V):	1.8
Ready or Busy:	YES
Peak Reflow Temperature (C):	260
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	OTHER
Data Polling:	NO
Power Supplies (V):	1.8

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