KFG2816U1M-DIB by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	KFG2816U1M-DIB
Description	EEPROM CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 67; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 30 mA;
Datasheet	KFG2816U1M-DIB Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00005 Amp
Organization:	8MX16
Programming Voltage (V):	2.7
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	30 mA
Command User Interface:	YES
Terminal Finish:	MATTE TIN
No. of Terminals:	67
No. of Words:	8388608 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B67
No. of Sectors/Size:	256
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	FBGA
Moisture Sensitivity Level (MSL):	1
Memory Density:	134217728 bit
Sector Size (Words):	32K
Toggle Bit:	NO
Memory IC Type:	EEPROM CARD
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
Page Size (words):	512
Type:	NAND TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA67,8X10,32
Maximum Access Time:	14.5 ns
No. of Words Code:	8M
Nominal Supply Voltage / Vsup (V):	3.3
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Data Polling:	NO
Power Supplies (V):	3.3

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