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Manufacturer | Samsung |
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Manufacturer's Part Number | KFW8G16Q2M-DEB80 |
Description | FLASH; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 63; Package Code: LFBGA; Package Shape: RECTANGULAR; Organization: 512KX16; |
Datasheet | KFW8G16Q2M-DEB80 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 512KX16 |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 1.4 mm |
Programming Voltage (V): | 1.8 |
Minimum Supply Voltage (Vsup): | 1.7 V |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Command User Interface: | YES |
No. of Terminals: | 63 |
No. of Words: | 524288 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B63 |
No. of Sectors/Size: | 8K |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | LFBGA |
Width: | 10 mm |
Memory Density: | 8388608 bit |
Sector Size (Words): | 64K |
Toggle Bit: | NO |
Memory IC Type: | FLASH |
Minimum Operating Temperature: | -30 Cel |
Memory Width: | 16 |
Page Size (words): | 1K |
No. of Functions: | 1 |
Type: | SLC NAND TYPE |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA63,10X12,32 |
Length: | 13 mm |
Maximum Access Time: | 76 ns |
No. of Words Code: | 512K |
Nominal Supply Voltage / Vsup (V): | 1.8 |
Ready or Busy: | YES |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | .8 mm |
Temperature Grade: | COMMERCIAL EXTENDED |
Maximum Supply Voltage (Vsup): | 1.95 V |
Data Polling: | NO |
Power Supplies (V): | 1.8 |