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Manufacturer | Samsung |
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Manufacturer's Part Number | KFWAGH6U4M-DIB60 |
Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: LFBGA; Package Shape: RECTANGULAR; Command User Interface: YES; |
Datasheet | KFWAGH6U4M-DIB60 Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Programming Voltage (V): | 3.3 |
Minimum Supply Voltage (Vsup): | 2.7 V |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Technology: | CMOS |
No. of Sectors/Size: | 4K |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Package Code: | LFBGA |
Toggle Bit: | NO |
Memory Width: | 16 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA63,10X12,32 |
Additional Features: | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
Ready or Busy: | YES |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | .8 mm |
Maximum Standby Current: | .00016 Amp |
Organization: | 1GX16 |
Maximum Seated Height: | 1.4 mm |
Maximum Supply Current: | 50 mA |
Command User Interface: | YES |
No. of Terminals: | 63 |
No. of Words: | 1073741824 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
JESD-30 Code: | R-PBGA-B63 |
Maximum Operating Temperature: | 85 Cel |
Width: | 10 mm |
Boot Block: | INDEPENDENT |
Memory Density: | 17179869184 bit |
Sector Size (Words): | 256K |
Memory IC Type: | FLASH |
Minimum Operating Temperature: | -40 Cel |
Page Size (words): | 2K |
No. of Functions: | 1 |
Type: | MLC NAND TYPE |
Length: | 13 mm |
Maximum Access Time: | 76 ns |
No. of Words Code: | 1G |
Nominal Supply Voltage / Vsup (V): | 3.3 |
Parallel or Serial: | PARALLEL |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3.6 V |
Data Polling: | NO |
Power Supplies (V): | 3/3.3 |