KFWAGH6U4M-DIB6T by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	KFWAGH6U4M-DIB6T
Description	EEPROM CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: FBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
Datasheet	KFWAGH6U4M-DIB6T Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00016 Amp
Organization:	1GX16
Programming Voltage (V):	2.7
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	50 mA
Command User Interface:	YES
Terminal Finish:	MATTE TIN
No. of Terminals:	63
No. of Words:	1073741824 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B63
No. of Sectors/Size:	4K
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	FBGA
Moisture Sensitivity Level (MSL):	1
Boot Block:	INDEPENDENT
Memory Density:	17179869184 bit
Sector Size (Words):	256K
Toggle Bit:	NO
Memory IC Type:	EEPROM CARD
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
Page Size (words):	2K
Type:	NAND TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA63,10X12,32
Maximum Access Time:	76 ns
No. of Words Code:	1G
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Data Polling:	NO
Power Supplies (V):	3/3.3

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