Samsung - KLM8G1GESD-B04P0

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KLM8G1GESD-B04P0 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number KLM8G1GESD-B04P0
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
Datasheet KLM8G1GESD-B04P0 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 8GX8
Programming Voltage (V): 1.8
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 153
No. of Words: 8589934592 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B153
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Memory Density: 68719476736 bit
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Type: MLC NAND TYPE
No. of Words Code: 8G
Additional Features: IT ALSO OPERATES AT 2.7V TO 3.6V
Parallel or Serial: SERIAL
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 1.95 V
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