Samsung - KLM8G1WEMB-B0310

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KLM8G1WEMB-B0310 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number KLM8G1WEMB-B0310
Description FLASH CARD; Package Code: BGA; Package Shape: RECTANGULAR; Organization: 8GX8; Additional Features: ALSO ORGANISED AS 64Gbx1; Memory Width: 8;
Datasheet KLM8G1WEMB-B0310 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 8GX8
Maximum Seated Height: .8 mm
Programming Voltage (V): 5
Surface Mount: YES
Maximum Clock Frequency (fCLK): 200 MHz
No. of Words: 8589934592 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Package Code: BGA
Width: 11.5 mm
Memory Density: 68719476736 bit
Memory IC Type: FLASH CARD
Memory Width: 8
No. of Functions: 1
Type: MLC NAND TYPE
Length: 13 mm
No. of Words Code: 8G
Nominal Supply Voltage / Vsup (V): 5
Additional Features: ALSO ORGANISED AS 64Gbx1
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