KLMBG8FE3B-A001 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	KLMBG8FE3B-A001
Description	FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: TFBGA; Package Shape: RECTANGULAR; Organization: 32GX8;
Datasheet	KLMBG8FE3B-A001 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	32GX8
Maximum Seated Height:	1.2 mm
Programming Voltage (V):	3.3
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
No. of Terminals:	169
Maximum Clock Frequency (fCLK):	52 MHz
No. of Words:	34359738368 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B169
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TFBGA
Width:	12 mm
Memory Density:	274877906944 bit
Memory IC Type:	FLASH CARD
Minimum Operating Temperature:	-25 Cel
Memory Width:	8
No. of Functions:	1
Length:	16 mm
No. of Words Code:	32G
Nominal Supply Voltage / Vsup (V):	3.3
Additional Features:	1.8V NOMINAL SUPPLY IS ALSO AVAILABLE
Parallel or Serial:	PARALLEL
Terminal Pitch:	.5 mm
Temperature Grade:	OTHER
Maximum Supply Voltage (Vsup):	3.6 V

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