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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | KLMCG8WEMC-B0310 |
| Description | FLASH CARD; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Terminal Position: BOTTOM; Memory Density: 549755813888 bit; |
| Datasheet | KLMCG8WEMC-B0310 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Memory Density: | 549755813888 bit |
| Organization: | 64GX8 |
| Maximum Seated Height: | 1 mm |
| Programming Voltage (V): | 5 |
| Surface Mount: | YES |
| Memory IC Type: | FLASH CARD |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Maximum Clock Frequency (fCLK): | 200 MHz |
| Type: | MLC NAND TYPE |
| No. of Words: | 68719476736 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Length: | 13 mm |
| Technology: | CMOS |
| No. of Words Code: | 64G |
| JESD-30 Code: | R-PBGA-B |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Nominal Supply Voltage / Vsup (V): | 5 |
| Package Code: | BGA |
| Width: | 11.5 mm |
