KM23257P-25 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	KM23257P-25
Description	MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
Datasheet	KM23257P-25 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	32KX8
Sub-Category:	MASK ROMs
Surface Mount:	NO
Maximum Supply Current:	75 mA
Terminal Finish:	TIN LEAD
No. of Terminals:	28
No. of Words:	32768 words
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Technology:	MOS
JESD-30 Code:	R-PDIP-T28
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Maximum Operating Temperature:	70 Cel
Package Code:	DIP
Moisture Sensitivity Level (MSL):	3
Memory Density:	262144 bit
Memory IC Type:	MASK ROM
JESD-609 Code:	e0
Minimum Operating Temperature:	0 Cel
Memory Width:	8
Qualification:	Not Qualified
Package Equivalence Code:	DIP28,.6
Maximum Access Time:	250 ns
No. of Words Code:	32K
Terminal Pitch:	2.54 mm
Temperature Grade:	COMMERCIAL

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