KM23C4001B-10 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	KM23C4001B-10
Description	MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 524288 words;
Datasheet	KM23C4001B-10 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	512KX8
Surface Mount:	NO
No. of Terminals:	32
No. of Words:	524288 words
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Technology:	CMOS
JESD-30 Code:	R-PDIP-T32
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	DIP
Memory Density:	4194304 bit
Memory IC Type:	MASK ROM
Minimum Operating Temperature:	0 Cel
Memory Width:	8
No. of Functions:	1
Qualification:	Not Qualified
Maximum Access Time:	100 ns
No. of Words Code:	512K
Nominal Supply Voltage / Vsup (V):	5
Parallel or Serial:	PARALLEL
Temperature Grade:	COMMERCIAL

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