KM23C4100FP3-15 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	KM23C4100FP3-15
Description	MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE; Terminal Position: QUAD;
Datasheet	KM23C4100FP3-15 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.0001 Amp
Organization:	256KX16
Sub-Category:	MASK ROMs
Surface Mount:	YES
Maximum Supply Current:	30 mA
Terminal Finish:	TIN LEAD
No. of Terminals:	44
No. of Words:	262144 words
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK
Technology:	CMOS
JESD-30 Code:	S-PQFP-G44
Package Shape:	SQUARE
Terminal Form:	GULL WING
Maximum Operating Temperature:	70 Cel
Package Code:	QFP
Moisture Sensitivity Level (MSL):	3
Memory Density:	4194304 bit
Memory IC Type:	MASK ROM
JESD-609 Code:	e0
Minimum Operating Temperature:	0 Cel
Memory Width:	16
Qualification:	Not Qualified
Package Equivalence Code:	QFP44,.7SQ,32
Alternate Memory Width:	8
Maximum Access Time:	150 ns
No. of Words Code:	256K
Nominal Supply Voltage / Vsup (V):	5
Terminal Pitch:	.8 mm
Temperature Grade:	COMMERCIAL
Power Supplies (V):	5

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