KM23V4100CG by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	KM23V4100CG
Description	MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;
Datasheet	KM23V4100CG Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00003 Amp
Organization:	256KX16
Sub-Category:	MASK ROMs
Surface Mount:	YES
Maximum Supply Current:	25 mA
Terminal Finish:	TIN LEAD
No. of Terminals:	40
No. of Words:	262144 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE
Technology:	CMOS
JESD-30 Code:	R-PDSO-G40
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	70 Cel
Package Code:	SOP
Moisture Sensitivity Level (MSL):	3
Memory Density:	4194304 bit
Memory IC Type:	MASK ROM
JESD-609 Code:	e0
Minimum Operating Temperature:	0 Cel
Memory Width:	16
Qualification:	Not Qualified
Package Equivalence Code:	SOP40,.56
Alternate Memory Width:	8
Maximum Access Time:	150 ns
No. of Words Code:	256K
Terminal Pitch:	1.27 mm
Temperature Grade:	COMMERCIAL
Power Supplies (V):	3/3.3

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