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Manufacturer | Samsung |
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Manufacturer's Part Number | KM23V64005BF |
Description | MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
Datasheet | KM23V64005BF Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .00005 Amp |
Organization: | 4MX16 |
Sub-Category: | MASK ROMs |
Surface Mount: | YES |
Maximum Supply Current: | 60 mA |
Terminal Finish: | Tin/Lead (Sn/Pb) |
No. of Terminals: | 48 |
No. of Words: | 4194304 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B48 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Package Code: | FBGA |
Memory Density: | 67108864 bit |
Memory IC Type: | MASK ROM |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 16 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA48,6X8,30 |
Alternate Memory Width: | 8 |
Maximum Access Time: | 120 ns |
No. of Words Code: | 4M |
Terminal Pitch: | .75 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 3/3.3 |