Samsung - KM4X6001KM-B3210

KM4X6001KM-B3210 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number KM4X6001KM-B3210
Description MEMORY CIRCUIT; No. of Terminals: 254; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; Terminal Form: BALL; No. of Words Code: 32G;
Datasheet KM4X6001KM-B3210 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Memory Density: 274877906944 bit
Organization: 32GX8
Mixed Memory Type: DRAM+NAND
Surface Mount: YES
Memory IC Type: MEMORY CIRCUIT
Memory Width: 8
No. of Functions: 1
No. of Terminals: 254
No. of Words: 34359738368 words
Terminal Position: BOTTOM
Technology: CMOS
No. of Words Code: 32G
JESD-30 Code: R-PBGA-B254
Package Shape: RECTANGULAR
Terminal Form: BALL
Additional Features: DRAM DENSITY IS 16G BITS
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