Samsung - KS57C0208N-XX

KS57C0208N-XX by Samsung

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Manufacturer Samsung
Manufacturer's Part Number KS57C0208N-XX
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: SDIP; Package Shape: RECTANGULAR;
Datasheet KS57C0208N-XX Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Microcontrollers
Surface Mount: NO
Maximum Supply Current: 4 mA
Terminal Finish: TIN LEAD
No. of Terminals: 24
Terminal Position: DUAL
Package Style (Meter): IN-LINE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDIP-T24
Package Shape: RECTANGULAR
ROM Words: 8192
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 85 Cel
Package Code: SDIP
Moisture Sensitivity Level (MSL): 3
Speed: 1.05 rpm
RAM Bytes: 256
Bit Size: 4
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: SDIP24,.3
ROM Programmability: MROM
Terminal Pitch: 1.78 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2.2/5.5
CPU Family: SAM4
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