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Manufacturer | Samsung |
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Manufacturer's Part Number | KS57C0208N-XX |
Description | Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: SDIP; Package Shape: RECTANGULAR; |
Datasheet | KS57C0208N-XX Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Sub-Category: | Microcontrollers |
Surface Mount: | NO |
Maximum Supply Current: | 4 mA |
Terminal Finish: | TIN LEAD |
No. of Terminals: | 24 |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE, SHRINK PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PDIP-T24 |
Package Shape: | RECTANGULAR |
ROM Words: | 8192 |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 85 Cel |
Package Code: | SDIP |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 1.05 rpm |
RAM Bytes: | 256 |
Bit Size: | 4 |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | SDIP24,.3 |
ROM Programmability: | MROM |
Terminal Pitch: | 1.78 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 2.2/5.5 |
CPU Family: | SAM4 |