Samsung - KS57C2616Q

KS57C2616Q by Samsung

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Manufacturer Samsung
Manufacturer's Part Number KS57C2616Q
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR;
Datasheet KS57C2616Q Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 8 mA
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 100
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: R-PQFP-G100
Package Shape: RECTANGULAR
ROM Words: 16384
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: QFP
Speed: 1.05 rpm
RAM Bytes: 368
Bit Size: 4
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: QFP100,.7X.9
ROM Programmability: MROM
Terminal Pitch: .635 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3/5
CPU Family: SAM4
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