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Manufacturer | Samsung |
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Manufacturer's Part Number | KS57C5304(DIP30) |
Description | Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 30; Package Code: DIP; Package Shape: RECTANGULAR; |
Datasheet | KS57C5304(DIP30) Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Sub-Category: | Microcontrollers |
Surface Mount: | NO |
Maximum Supply Current: | 8 mA |
Terminal Finish: | Tin/Lead (Sn/Pb) |
No. of Terminals: | 30 |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | CMOS |
JESD-30 Code: | R-PDIP-T30 |
Package Shape: | RECTANGULAR |
ROM Words: | 4096 |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 85 Cel |
Package Code: | DIP |
Speed: | 6 rpm |
RAM Bytes: | 384 |
Bit Size: | 4 |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP30,.4 |
ROM Programmability: | MROM |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 2/5 |
CPU Family: | SAM47 |