Samsung - KS57C5312(DIP30)

KS57C5312(DIP30) by Samsung

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Manufacturer Samsung
Manufacturer's Part Number KS57C5312(DIP30)
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 30; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet KS57C5312(DIP30) Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Microcontrollers
Surface Mount: NO
Maximum Supply Current: 8 mA
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 30
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-PDIP-T30
Package Shape: RECTANGULAR
ROM Words: 12288
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 85 Cel
Package Code: DIP
Speed: 6 rpm
RAM Bytes: 384
Bit Size: 4
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: DIP30,.4
ROM Programmability: MROM
Terminal Pitch: 2.54 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2/5
CPU Family: SAM47
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